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The Chinese University of Hong Kong
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AgenticECO clears 7 out of 9 defect cases with minimal disturbance, revolutionizing ECO processes in 3D-ICs by ensuring repair attribution without the chaos of full rerouting.
Early-stage 3D IC design can now achieve accurate performance predictions by integrating thermal and cache effects into the layout optimization process.
AgenticPD redefines physical design optimization by enabling stage-aware decision-making, drastically cutting costs and improving timing results.