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The paper introduces CLIP-3D, a novel framework that integrates physical constraints into the early-stage design of 3D integrated circuits (ICs) to accurately predict performance metrics like billion-instructions-per-second (BIPS). By utilizing a closed-loop evaluation that combines architectural configurations with detailed thermal and power analysis, CLIP-3D allows designers to optimize layout decisions before finalizing designs. The key finding is that this approach significantly enhances the accuracy of performance predictions by accounting for real-world thermal and cache effects, which are often overlooked in traditional architectural simulators.
Early-stage 3D IC design can now achieve accurate performance predictions by integrating thermal and cache effects into the layout optimization process.
3D integration packs more power into a smaller footprint, so a candidate design's actual throughput depends on its layout: which macro sits on which tier, where the hot spot lands, and how cache geometry maps to access cycles. Architectural simulators like gem5 report IPC under idealized timing. They do not produce the per-block power map, the cache cycle counts, or the 3D layout that decide the realized billion-instructions-per-second (BIPS), so early-stage 3D-IC exploration selects designs without accounting for the effects that decide whether they throttle on silicon. We present CLIP-3D, a shift-left flow that exposes 3D layout-driven thermal, wire, and cache effects to early-stage architectural exploration before any sign-off tool is invoked. The first stage lifts an architectural configuration into a physical block representation: McPAT for per-block dynamic and leakage power, CACTI for cache geometry and access cycles, and a HotSpot-compatible 3D stack discretization. The second stage runs an analytical 3D thermal-aware floorplanner over that representation. The floorplanner objective embeds a closed-form sustained-frequency expression derived from the linearity of HotSpot's steady-state operator and the standard CMOS power-frequency decomposition. Cross-tier macro assignment and in-plane placement are co-optimized for the realized BIPS rather than for a half-perimeter wirelength (HPWL)-plus-temperature surrogate with hand-tuned weights.
