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This paper analyzes the intersection of heterogeneous 2.5D chiplet systems and Large Language Models (LLMs) within Electronic Design Automation (EDA), highlighting the expanded hardware attack surface introduced by these technologies. It identifies various attack vectors at architectural, logical, and physical levels, as well as vulnerabilities in LLM-driven EDA pipelines. The authors propose a defense strategy utilizing 2.5D split manufacturing and active interposers to create physically isolated Root of Trust architectures, while also exploring how LLMs can enhance hardware security measures.
The integration of LLMs into EDA workflows could significantly amplify hardware vulnerabilities, but innovative defenses like split manufacturing may offer a pathway to secure chiplet systems.
The semiconductor industry is undergoing a dual revolution: the shift toward heterogeneous 2.5D chiplet systems and the integration of Large Language Models (LLMs) into Electronic Design Automation (EDA) flows. While these paradigms offer unprecedented benefits in yield, modularity, design productivity, etc., they radically expand the hardware attack surface. This paper provides a unified analysis of these frontiers, ranging from attacks on chiplet systems (including hardware stacks for LLM acceleration) across architectural, logical, and physical levels, to various exploits against LLM-driven EDA pipelines. To secure chiplet systems, we review a powerful defense approach that leverages 2.5D split manufacturing and active interposers for physically isolated Root of Trust (RoT) architectures. To secure LLM-driven EDA pipelines, we first identify native threats and then review state-of-the-art defense techniques. Finally, we discuss how LLM systems can advance hardware security efforts for modern systems, including chiplets.
