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This paper introduces an open-source benchmark suite specifically designed for 3D integrated circuit (3D-IC) test cases, addressing the limitations of existing planar benchmarks in light of new 3D heterogeneous integration technologies. The suite includes reusable virtual chiplet models that encompass various components such as compute, memory, and I/O, while capturing critical physical design characteristics like inter-die connectivity and technology-dependent constraints. By providing a standardized evaluation platform, this work aims to facilitate reproducible research and drive advancements in the field of 3D physical design.
A new open-source benchmark suite for 3D-ICs could revolutionize how researchers tackle the complexities of heterogeneous integration technologies.
The physical design community has benefited from standardized, publicly available benchmark suites, which have enabled reproducible evaluation and driven significant advances in 2D place-and-route algorithms over the past three decades. However, the emergence of 3D heterogeneous integration technologies, including through-silicon vias (TSVs), hybrid bonding, and chiplet-based architectures, has introduced new physical design challenges that are not captured by existing planar benchmarks. Although several 3D-IC design examples have been reported, publicly accessible and scalable benchmark suites that enable reproducible evaluation across different 3D physical design problems remain limited. In this paper, we present an open-source suite of 3D-IC benchmark testcases derived from representative chiplet-based case studies in CATCH, an open-source framework for estimating the cost of heterogeneous integration architectures. The proposed benchmark suite provides reusable virtual chiplet models covering compute, memory, I/O, analog, and substrate components. Each testcase captures essential physical design characteristics of 3D systems, including heterogeneous die integration, inter-die connectivity, and technology-dependent design constraints. By publicly releasing these benchmarks, we aim to establish a common evaluation platform and accelerate community-wide research progress in 3D heterogeneous integration.
