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This paper introduces an interconnect-aware logic resynthesis technique to minimize super-long lines (SLLs) in multi-die FPGAs, which are a major source of delay and routing congestion. The method restructures the LUT-level netlist using die partitioning information to guide logic resubstitutions, simplifying local circuits and eliminating SLLs before physical implementation. Experiments on EPFL benchmarks demonstrate SLL reductions of up to 27.38% for 3-die FPGAs compared to a state-of-the-art framework, while MCNC benchmarks show an average SLL reduction of 1.65% with preserved placement quality.
Reduce interconnect overhead in multi-die FPGAs by up to 27% with a novel logic resynthesis technique that minimizes super-long lines *before* physical implementation.
Multi-die FPGAs enable device scaling beyond reticle limits but introduce severe interconnect overhead across die boundaries. Inter-die connections, commonly referred to as super-long lines (SLLs), incur high delay and consume scarce interposer interconnect resources, often dominating critical paths and complicating physical design. To address this, this work proposes an interconnect-aware logic resynthesis method that restructures the LUT-level netlist to reduce the number of SLLs. The resynthesis engine uses die partitioning information to apply logic resubstitutions, which simplifies local circuit structures and eliminates SLLs. By reducing the number of SLLs early in the design flow, prior to physical implementation, the proposed method shortens critical paths, alleviates pressure on scarce interposer interconnect resources, and improves overall physical design flexibility. We further build a tool flow for multi-die FPGAs by integrating the proposed resynthesis method with packing and placement. Experimental results on the EPFL benchmarks show that, compared with a state-of-the-art framework, the proposed method reduces the number of SLLs by up to 24.8% for a 2-die FPGA and up to 27.38% for a 3-die FPGA. On MCNC benchmarks, our tool flow achieves an average SLL reduction of 1.65% while preserving placement quality. On Koios benchmarks, where fewer removable SLLs exist, several designs still exhibit considerable inter-die edge reductions. Overall, the results confirm that reducing inter-die connections at the logic level is an effective approach for multi-die FPGAs.
