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This paper introduces DICE, a novel in-simulation runtime PHY modeling framework integrated into gem5, which accurately simulates the inter-chiplet datapath in chiplet designs. By addressing the dynamic behaviors of high-bandwidth links, such as signal integrity issues and adaptive packet retransmissions, DICE significantly improves the fidelity of performance metrics like IPC compared to traditional fixed-latency models. The results demonstrate that neglecting these runtime-dependent factors can lead to substantial inaccuracies in simulation outcomes, underscoring the necessity for more sophisticated modeling approaches in chiplet architectures.
Ignoring dynamic signal integrity effects can skew inter-chiplet performance predictions by a significant margin, revealing critical flaws in current simulation practices.
Scaling monolithic multicores is increasingly constrained by power/thermal limits, yield, and rising manufacturing and testing costs. Chiplet designs address these challenges by partitioning large dies into smaller parts (typically multiple core-complex dies and an I/O die) linked via high-bandwidth physical fabrics (PHY). As bandwidth and wiring density scale, however, these short-reach links are pushed closer to their signal-integrity limits, increasing susceptibility to noise, crosstalk, and channel loss, motivating stronger link-level reliability mechanisms such as forward error correction (FEC). Despite this trend, state-of-the-art simulation infrastructures often approximate inter-chiplet links using oversimplified, fixed-latency models. Such abstractions overlook the inherently dynamic, runtime-dependent behavior of the PHY -- including channel conditions (e.g., signal-to-noise ratio shifts, signal crosstalk, clock jitter), iterative decoder convergence and packet retransmissions, and application dynamics (e.g., LLC-misses that travel across chiplet boundaries) -- all of which are hard to determine offline. We show that neglecting these effects distorts inter-chiplet packet-level timing and high-level performance metrics such as IPC, leading to off-trend simulation results. We present DICE, an in-simulation, runtime PHY modeling in gem5 that captures the end-to-end inter-chiplet datapath, including QC-LDPC encoding/decoding, PAM4 modulation, lossy-channel transmission, LLR-based demodulation, adaptive packet re-sending, and PHY-level flow control between chiplets.
