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This paper enhances the open-source FPGA CAD tool VTR to model and optimize multi-die routing architectures for 2.5D and 3D FPGAs, addressing the limitations imposed by die-stacking technology. By conducting HSPICE-based circuit modeling and exploring various design parameters, the authors demonstrate that tailored inter-die routing can significantly improve performance metrics such as wirelength and critical path delay. The findings reveal that 3D FPGAs can achieve a 14% reduction in wirelength and a 6% improvement in critical path delay compared to traditional 2D devices, while 2.5D FPGAs maintain minimal overhead with increased connectivity.
Tailored inter-die routing architectures can unlock significant performance gains in 2.5D and 3D FPGAs, challenging the limitations of traditional designs.
Die stacking has enabled 2.5D FPGAs by integrating multiple active dice on a passive silicon interposer for improved yield and capacity, and paved the way for 3D architectures that stack active dice directly atop one another. In these multi-die devices, the unique electrical and physical characteristics of the underlying die-stacking technology impose limitations on inter-die connection density and latency, necessitating a bespoke inter-die routing architecture. However, the absence of accurate and versatile modeling tools has left most questions about how to best design the inter-die routing architecture unanswered. To address this gap, we enhance the open-source FPGA CAD tool VTR to flexibly model a wide range of multi-die routing architectures, and augment VPR's placement and routing engines to improve optimization for both 2.5D and 3D FPGAs. We perform HSPICE-based circuit modeling of inter-die connections for active dice using a 7 nm process node and a 45 nm silicon interposer across several die-crossing technologies. Using this enhanced framework, we conduct a detailed design space exploration of inter-die routing architecture in 2.5D and 3D FPGAs, characterizing the impact of die-crossing technology, inter-die connection count, fan-in/fan-out, and interposer wire length on critical path delay (CPD), wirelength, area, and routability. Our results show that with suitable inter-die routing architectures, 2.5D and 3D FPGAs can increase capacity without significant routability or delay penalties. Specifically, 3D FPGAs achieve up to 14% wirelength reduction and 6% CPD improvement over 2D devices, and remain routable even with existing $10\,渭$m pitch technologies, while 2.5D FPGAs incur only a 2% wirelength and 4% CPD overhead at 32% inter-die connectivity. All extensions are open source and integrated with the VTR master branch.
