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ETHCEAChalmersFoundation for Research and Technology –FraunhoferIST LisbonSemidynamicsApr 14, 2026arXiv:2604.12715The paper introduces EPAC, a RISC-V accelerator chip developed as part of the European Processor Initiative, integrating three distinct RISC-V compute tiles (VEC, STX, VRP) optimized for different HPC workloads. These tiles are interconnected via a CHI-based network-on-chip with a distributed L2 cache. The chip, implemented in GF22FDX technology, was successfully taped out and brought up, validating all major IP blocks.
Europe's collaborative EPAC chip delivers a heterogeneous RISC-V accelerator, showcasing a path towards domain-specific HPC hardware built with open standards.
This paper presents EPAC, a RISC-V-based accelerator chip developed within the European Processor Initiative (EPI) as part of a multi-year, multi-partner effort to build a European HPC processor ecosystem. EPAC is implemented in GlobalFoundries 22FDX (GF22FDX) technology, covers an area of 27 sq mm with approximately 0.3 billion transistors, and integrates three distinct RISC-V compute tiles targeting different workload classes: VEC, a vector processing tile for double-precision HPC workloads; STX, a many-core tile optimized for stencil and machine learning computations; and VRP, a variable-precision tile for iterative numerical solvers requiring extended floating-point formats. All tiles are connected through a Coherent Hub Interface (CHI) based network-on-chip with a distributed L2 cache system and communicate with external memory via a SerDes link. The chip was taped out in GF22FDX technology and successfully brought up, with all major IP blocks validated. This paper describes the architecture of each tile and the uncore infrastructure, the integration and physical implementation process, and the board-level bring-up activities. It also reflects on the engineering and coordination lessons learned from a full chip design effort distributed across academic and industrial partners in Europe.
