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This work establishes tighter theoretical limits on binary constant-power and low-power error-correcting cooling codes designed to mitigate thermal throttling and power spikes in on-chip interconnects. As high-throughput hardware interconnects face strict thermal dissipation constraints, determining the exact capacity of simultaneous error-correcting and heat-reducing codes becomes crucial for optimal chip design. By lowering the operational threshold condition from quadratic order to $\sim \sqrt{2}t^{3/2}$ and applying Steiner system constructions, the authors prove new upper bounds that are strictly tighter than prior art and asymptotically attainable.
Thermal-aware coding limits for high-speed hardware interconnects just became significantly sharper, slashing the minimum weight requirement from $\mathcal{O}(t^2)$ to $\mathcal{O}(t^{3/2})$ while proving asymptotic tightness.
Low-power error-correcting cooling (LPECC) codes and constant-power error-correcting cooling (CPECC) codes provide error correction while controlling power consumption and thermal effects in on-chip buses. In this paper, we study binary CPECC and LPECC codes with \(e=w-3\). For CPECC codes, we extend the applicability of the upper bound previously obtained by Zhao and Zhang from the quadratic-order condition \(w\ge 2t(t+1)+2\) to \(w\ge w_0(t)\), where \(w_0(t)\sim \sqrt{2}\,t^{3/2}\). Using Steiner systems, we show that the CPECC bound is attainable and asymptotically tight for fixed \(t,w\). For LPECC codes, we establish the new upper bound \(\left\lfloor\frac{\binom{n+2}{3}}{\binom{w+t}{3}}\right\rfloor\) for \(w\ge μ(t)\), where \(μ(t)\sim \sqrt{2}\,t^{3/2}\). This bound is strictly smaller than the previous bound of Zhao and Zhang whenever both apply, and is asymptotically tight for fixed \(t,w\) in the stated range.