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This paper characterize RDMA-over-TB communication on Mac Studio nodes, showing that the measured bandwidth is far below nominal TB specifications, and compares Apple Silicon with an NVIDIA H100 platform to quantify the trade-off between memory capacity, throughput, and acquisition cost.
Intra-warp load imbalance, a major bottleneck in GPU-accelerated Electronic Design Automation, can be eliminated through warp-level parallel orchestration, leading to significant speedups in static timing analysis.