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This paper introduces a distributed delay-based built-in self-test (BIST) framework for mixed-signal circuits in flexible electronics, utilizing dual-purpose ring oscillators and voltage-controlled oscillators to address the challenges posed by conventional testing methods. The proposed design achieves a remarkable 1100× reduction in area and a 5600× decrease in power consumption compared to previous IGZO-TFT implementations, while maintaining high defect coverage rates of 93% for individual defects and 88% for multiple defects. By embedding lightweight digital BIST within each oscillator stage, the framework enables effective defect detection without the need for external test equipment, making it highly suitable for ultra-low-power wearable applications.
Achieving 93% defect coverage in flexible electronics testing with a 5600× reduction in power consumption could revolutionize how we approach testing in ultra-low-power applications.
Flexible electronics (FE) based on indium gallium zinc oxide thin-film transistors (IGZO-TFTs) are emerging for ultra-low-power wearable applications. However, lack of packaging, limited pins, and high device variability make conventional Automatic Test Equipment (ATE) impractical for testing analog/mixed-signal circuits in FE. This work presents a dualpurpose ring oscillator (RO) and voltage-controlled oscillator (VCO) serving as functional timing blocks and core structures for a distributed delay-based BIST framework. The oscillators achieve $1100 \times$ area reduction and $5600 \times$ lower power than previous IGZO-TFT designs. Lightweight digital BIST embedded within each RO stage enables stage-wise delay monitoring for defect detection. The BIST achieves 93% defect coverage for individual defects and 88% for multiple simultaneous defects, with only 3% power overhead and no external test equipment.